- Datasheet www.infineon.com 04 |nderung des Bohrbildes Please read the sections "Import0a3nt noLtaicyeo"uatndnd"Weraurnngingasl"taVt t5h.e7enneduofVth7i.s3document 02 Layoutnderung, Zwei Pine (P1,N1) pro Substrat hinzu steimark steim Rebvisiskioonpi1n.0g0m 2024o-0r2-29 steim bertalan berta F3L500R12W3H7_H11 EasyPACK™ module Table of contents Table.
• Electrical features
- VCES = 1200 V - IC nom = 500 A / ICRM = 1000 A - Ultra fast IGBT chips
- Low ind-ucDtievteadilessiganbout hole specification for contacts refer to AN2009-01 chapter 2 - Low sw-itcDhiinagmleotsesress of drill P1,15mm - Low VCE-,saCt opper thickness in hole 25~50um
- Suitable Infineon gate drivers can be found under https://www.infineon.com/gdfinder
• Mechanical features
- 3.2 kV AC 1 minute insulation - High current pin - PressFIT contact technology - Rugged mounting due to integrated mounting clamps - Al2O3 substrate with low thermal resistance Potential applications
• .
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | F3L50R06W1E3_B11 |
Infineon |
IGBT | |
2 | F3L100R07W2E3_B11 |
Infineon |
IGBT-Module | |
3 | F3L100R12W2H3_B11 |
Infineon |
IGBT | |
4 | F3L150R07W2E3_B11 |
Infineon |
IGBT | |
5 | F3L150R12W2H3_B11 |
Infineon |
IGBT | |
6 | F3L15MR12W2M1_B69 |
Infineon |
IGBT | |
7 | F3L15R12W2H3_B27 |
Infineon |
IGBT | |
8 | F3L200R07PE4 |
Infineon |
IGBT | |
9 | F3L200R12N2H3_B47 |
Infineon |
IGBT | |
10 | F3L200R12W2H3_B11 |
Infineon |
IGBT | |
11 | F3L225R07W2H3P_B63 |
Infineon |
IGBT | |
12 | F3L25R12W1T4_B27 |
Infineon |
IGBT |