ESD5581 - ON Semiconductor

ESD5581 ESD Protection Diode

of survivability specs. © Semiconductor Components Industries, LLC, 2017 1 July, 2024 − Rev. 10 Publication Order Number: ESD5581/D ESD5581 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM Working Peak Reverse Voltage IR Maximum Reverse Leakage .

Features

• Low Clamping Voltage
• Small Body Outline Dimensions: 0.62 mm x 0.32 mm
• Low Body Height: 0.3 mm
• Stand−off Voltage: 5 V
• IEC61000−4−2 Level 4 ESD Protection
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Typical Applications
• mSD Card Protection
• Audio Line Protection
• GPIO MAXIMUM RATINGS Rating Symbol Value Unit IEC 61000−4−2 (ESD) Contact Air ±30 kV ±30 Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C Thermal Resistance, Junction−to−Ambient Junction and Storage Temperature Range Lead Solder Temperature − Maximum (10 Second Duration) .