EMIF02-SPK01C2 - STMicroelectronics

EMIF02-SPK01C2 EMI filter including ESD protection

The EMIF02-SPK01C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The Flip-Chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15 kV. Figure 1.

Features

le
• EMI symmetrical (I/O) low-pass filter so
• High efficiency EMI filter (-33 dB @ 900 MHz) b
• Very low PCB space consumption: O 1.07 mm x 1.47 mm ) -
• Very thin package: 0.670 mm t(s
• Coating resin on back side and lead free c package u
• High efficiency in ESD suppression rod
• High reliability offered by monolithic integration P
• High reduction of parasitic elements through te integration and wafer level packaging. le Complies with the following standards: so
• IEC 61000-4-2 level 4, on input pins: Ob
  – 15 kV (air discharge) required:
• Mobile phones and communication systems
• Comput.