The DAN217N3 consists of two diodes in a plastic surface mount package. The diodes are connected in series and the unit is designed for high-speed switching application in hybrid thick and thin-film circuits. Features • Small SMD Package (SOT-23) • Ultra-high Speed • Low Forward Voltage • Fast Reverse Recovery Time Absolute Maximum Ratings • Maximum Temper.
• Small SMD Package (SOT-23)
• Ultra-high Speed
• Low Forward Voltage
• Fast Reverse Recovery Time
Absolute Maximum Ratings
• Maximum Temperatures Storage Temperature .... -65 ~ +150 °C Junction Temperature..... +150 °C
• Maximum Power Dissipation Total Power Dissipation (Ta=25°C).... 250 m.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | DAN217 |
Rohm |
Switching diode | |
2 | DAN217 |
JCET |
SWITCHING DIODE | |
3 | DAN217 |
GME |
Surface mount switching diode | |
4 | DAN217 |
LITE-ON |
SURFACE MOUNT FAST SWITCHING DIODE | |
5 | DAN217 |
WON-TOP |
SURFACE MOUNT FAST SWITCHING DIODE | |
6 | DAN217 |
Galaxy Electrical |
Surface mount switching diode | |
7 | DAN217 |
Kexin |
Switching Diodes | |
8 | DAN217 |
LGE |
Surface Mount Switching Diodes | |
9 | DAN217 |
MCC |
Plastic-Encapsulate Diode | |
10 | DAN217FH |
Rohm |
Switching Diode | |
11 | DAN217G |
Zowie Technology |
Switching Diode | |
12 | DAN217S3 |
CYStech |
HIGH-SPEED SWITCHING DIODE |