CR10 - Excelitas

CR10 Ceramic Chip SMD

The solder pads provide an excellent heat sink. For multi-chip arrays just choose 2 or more CERLEDs and mount them side by side or even antiparallel. Small true chip - LED to build custom configurations. Available on special order in 8 mm blister tape or solid strips of up to 12 pcs with a true pitch of 1.27 mm. Features and Benefits Solid state ceramic chi.

Features

Solid state ceramic chip Surface mounting device High thermal conductivity Superior light uniformity End - to - end and side - to - side stackable down to a pitch of 1.3 mm Solder pads conform with Mil-Std 883 B Ideal for data transmission www.excelitas.com Maximum Ratings at 25° C Power dissipation Derating linear Peak forward current Continuous forward current Junction temperature Storage temperature Operating temperature Soldering temperature Ptot IFSM (10 µs) IF Tj Tst Top Tsold (10 s) 130 mW 2.4 mW / ° C 800 mA 75 mA 120° C -25° C to 120° C -25° C to 80°.