OF CODE Mono-layer type Normal Bead Multi-layer type Normal Bead 3 DIMENSION ● CODE 05 10 21 31 32 41 43 DIMENSION(L×W) 1.0×0.5 1.6×0.8 2.0× 1.25 3.2×1.6 3.2×2.5 4.5×1.6 4.5×3.2 4 MATERIAL CODE ● CODE P,U J K N DESCRIPTION OF CODE Broad impedance, especially suppresses noise in the 10~200MHz range Suppresses noise in the 100~300MHz range Suppresses noi.
- Smallest inductors suitable for surface mounting - Perfect shape for automatic mounting, with no directionality - Excellent solderability and high heat resistance for either flow or reflow soldering - Monolithic inorganic material construction for high reliability - Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs.
CIB/CIM Series
Applications
- High frequency EMI prevention application applicable to computers, printers, VCRs, TVs and 9 portable telephones
Part Numbering
CI 1
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M 2
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10 3
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J 4
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121 N 5 6
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C 7
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8
1 SAMSUNG MULTILAYER.
Chip Bead ; CIB/CIM Series For EMI Suppression Feature Smallest beads suitable for surface mounting Perfect shape for .
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | CIM05U100 |
Samsung |
Chip Bead | |
2 | CIM05U100 |
Samsung |
Chip Bead | |
3 | CIM05U121 |
Samsung |
Chip Bead | |
4 | CIM05U121 |
Samsung |
Chip Bead | |
5 | CIM05U221 |
Samsung |
Chip Bead | |
6 | CIM05U241 |
Samsung |
Chip Bead | |
7 | CIM05U241 |
Samsung |
Chip Bead | |
8 | CIM05U300 |
Samsung |
Chip Bead | |
9 | CIM05U300 |
Samsung |
Chip Bead | |
10 | CIM05U301 |
Samsung |
Chip Bead | |
11 | CIM05U301 |
Samsung |
Chip Bead | |
12 | CIM05U471 |
Samsung |
Chip Bead |