CIM05F470 - Samsung

CIM05F470 Chip Bead

Chip Bead ; CIB/CIM Series For EMI Suppression Feature Smallest beads suitable for surface mounting Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering. Monolithic inorganic material construction for high reliability. Closed magnetic circuit configuration avoids .

Features

ies. Operating Temp Storage Temp -55~+125 -10~+40 Dimensions Ferrite Body External Electrode d t W L SIZE CODE 03 05 10 21 31 32 41 43 L 0.6 0.03 1.0 0.05 1.6 0.15 2.0 0.2 3.2 0.2 3.2 0.2 4.5 0.2 4.5 0.2 W 0.3 0.03 0.5 0.05 0.8 0.15 1.25 0.2 1.6 0.2 2.5 0.2 1.6 0.2 3.2 0.2 t 0.3 0.03 0.5 0.05 0.8 0.15 0.9 0.2 1.1 0.2 1.3 0.2 1.6 0.2 / 1.2 0.2 1.5 0.2 Part Numbering CI M 03 J 121 N C (1) (2) (3) (4) (5) (6) (7) (1) Chip Beads (2) B:Mono-layer type, M:Multi-layer type (3) Dimension (4) Material Code P,U:Broad impedance, especially suppresses noise in the 10~200MHz range J :Suppr.