Chip Integration Technology Corporation CB230WSG-ST 2A Trench Schottky Rectifier Main Product Characteristics IF(AV) VRRM TJ VF(Typ) 2A 30V 125 OC 0.36V ■ Features • Ultra small surface mount package. • Low forward voltage drop. • Lead free in compliance with EU RoHS. ■ Mechanical data • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOD-3.
• Ultra small surface mount package.
• Low forward voltage drop.
• Lead free in compliance with EU RoHS.
■ Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-323ST
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
• Weight : Approximated 0.008 gram
■Outline
SOD-323ST
0.039(0.98) 0.031(0.78)
0.106(2.7) 0.091(2.3)
0.055(1.4) 0.047(1.2)
0.008(0.20)Max.
0.059(1.5) 0.043(1.1)
0.029(0.73) 0.025(0.63)
0.030 (0.75) 0.022 (0.55)
0.051(1.3) 0.035(0.9)
0.039(1.0) 0.022(0.55)
0.003(0.08)Max.
0.091(2.3) 0.083(2.1)
Dimensions in inches and (millim.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | CB2321Txxx |
TAITRON |
1.0A Surface Mount Bridge Rectifier | |
2 | CB2012 |
Taiyo Yuden |
WOUND CHIP INDUCTORS | |
3 | CB201209 |
Erocore |
Multilayer Chip Beads | |
4 | CB201209T-102Y-C3 |
Allpower |
EMI MULTILAYER FERRITE CHIP BEADS | |
5 | CB201209T-110Y-C3 |
Allpower |
EMI MULTILAYER FERRITE CHIP BEADS | |
6 | CB201209T-121Y-C3 |
Allpower |
EMI MULTILAYER FERRITE CHIP BEADS | |
7 | CB201209T-181Y-C3 |
Allpower |
EMI MULTILAYER FERRITE CHIP BEADS | |
8 | CB201209T-301Y-C3 |
Allpower |
EMI MULTILAYER FERRITE CHIP BEADS | |
9 | CB201209T-320Y-C3 |
Allpower |
EMI MULTILAYER FERRITE CHIP BEADS | |
10 | CB201209T-601Y-C3 |
Allpower |
EMI MULTILAYER FERRITE CHIP BEADS | |
11 | CB2016 |
Taiyo Yuden |
WOUND CHIP INDUCTORS | |
12 | CB2402 |
Chipbetter |
2.4GHZ WLAN TRANSMIT/RECEIVE FEM |