Dual, standard level N-channel MOSFET in an LFPAK56D package (half-bridge configuration), using Trench 9 TrenchMOS technology. This product has been designed and qualified to AEC-Q101. G1 An internal connection is made between the source (S1) of the high- side FET to the drain (D2) of the low-side FET, making the device ideal to use as a half-bridge s.
• LFPAK56D package with half-bridge configuration enables:
• Reduced PCB layout complexity
• PCB shrinkage through reduced component footprint for 3-phase motor drive
• Improved system level Rth(j-amb) due to optimized package design
• Lower parasitic inductance to support higher efficiency
• Footprint compatibility with LFPAK56D Dual package
• Advanced AEC-Q101 grade Trench 9 silicon technology:
• Low power losses, high power density
• Superior avalanche performance
• Repetitive avalanche rated
• LFPAK copper clip packaging provides high robustness and reliability
• Gull wing leads support hi.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | BUK7105-40AIE |
NXP |
TrenchPLUS standard level FET | |
2 | BUK7105-40ATE |
NXP |
N-channel TrenchPLUS standard level FET | |
3 | BUK7107-40ATC |
NXP |
TrenchPLUS standard level FET | |
4 | BUK7107-55AIE |
NXP |
TrenchPLUS standard level FET | |
5 | BUK7108-40AIE |
NXP |
TrenchPLUS standard level FET | |
6 | BUK714R1-40BT |
NXP |
TrenchMOS standard level FET | |
7 | BUK7207-30B |
NXP Semiconductors |
TrenchMOS standard level FET | |
8 | BUK7208-40B |
NXP Semiconductors |
TrenchMOS standard level FET | |
9 | BUK7210-55B |
NXP Semiconductors |
N-Channel MOSFET | |
10 | BUK7212-55B |
NXP |
TrenchMOS standard level FET | |
11 | BUK7213-40A |
NXP |
TrenchMOS standard level FET | |
12 | BUK7214-75B |
NXP |
Standard Level Fet |