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BL2012-10B5512 - Advanced Ceramic X

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BL2012-10B5512 Multilayer Chip Baluns

BL 2012 Series Multilayer Chip Baluns ACX Advanced Ceramic X Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN, etc. Specifications Frequency Unbalanced Balanced Insertion Part Number Range Imped.

Features

™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN, etc. Specifications Frequency Unbalanced Balanced Insertion Part Number Range Impedance Impedance Loss (MHz) (ohm) (ohm) (dB) VSWR @BW Phase Amplitude Difference Difference (degree) (dB) BL201210B5512_ 5150 ~ 5875 50 100 1.0 max. 2.0 max. 180 ± 10 2 max. Q’ty/Reel (pcs) Operating Temperature Range Storage Temperature Range Power Capacity : 4000 : -40 ~ +85 oC : -40 ~ +85 oC : 3.

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