ATS-50250B-C2-R0 - Advanced Thermal Solutions

ATS-50250B-C2-R0 Ultra High Performance BGA Cooling

Ultra High Performance BGA Cooling Solutions w/ maxiGRIP™ Attachment ATS PART # ATS-50250B-C2-R0 Features & Benefits » maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB Meets.

Features

& Benefits » maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards Comes preassembled with high performance, phase changing, thermal interface material Designed for standard height components from 3 to 4.5mm C D » » B A » » Thermal Performance Air Velocity
*Image abo.