AN241 - Philips

AN241 Thermal Considerations

Philips Semiconductors Advanced BiCMOS Products Application note Thermal considerations for advanced logic families (Futurebus+, ABT and MULTIBYTE) AN241 INTRODUCTION Thermal characteristics of integrated circuit packages have been and increasingly will be a major consideration to both producers and users of electronics products. This is because an incre.

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uch smaller, but the thermal energy is concentrated more densely on the printed wiring board. For these reasons, designers and manufacturers of surface mount assemblies must be aware of all the variables affecting TJ. There are five major factors controlled by the user which contribute to increased BiCMOS power dissipation. 1. Frequency of operation (output switching frequency) 2. Input voltage levels 3. Output loading (capacitive and resistive) 4. VCC level POWER DISSIPATION Power dissipation for the ABT (Advanced BiCMOS Technology), MULTIBYTE and Futurebus+ devices can be estimated using t.