1 Input Pin(~) 2 Input Pin(~) 3 Output Anode(+) 4 Output Cathode(-) MECHANICAL DATA • Case: ABS/LBF • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight: 88mg 0.0031oz 3 4 2 1 ABS/LBF Package Maximum Ratings and Electrical characteristics Ratings at 25 °C ambient temperature unless otherwise specified. Single phase half-wave 60 Hz, resi.
• Glass Passivated Chip Junction
• Reverse Voltage - 100 to 1000 V
• Forward Current - 2 A
• High Surge Current Capability
• Designed for Surface Mount Application
PINNING
PIN DESCRIPTION 1 Input Pin(~) 2 Input Pin(~) 3 Output Anode(+) 4 Output Cathode(-)
MECHANICAL DATA
• Case: ABS/LBF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 88mg 0.0031oz
3 4
2 1
ABS/LBF Package
Maximum Ratings and Electrical characteristics Ratings at 25 °C ambient temperature unless otherwise specified. Single phase half-wave 60 Hz, resistive or inductive load, for capacitive load curre.
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1 | ABS210 |
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2 | ABS210 |
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3 | ABS210 |
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4 | ABS210 |
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