This ACEPACK 2 power module in fourpack topology integrates advanced silicon carbide Power MOSFET technology from STMicroelectronics. The module leverages the innovative properties of the wide-bandgap SiC material and a high-thermalperformance substrate. The result is exceptionally low on-resistance per unit area and excellent switching performance that is v.
ACEPACK 2
• Fourpack topology
• ACEPACK 2 power module
– 13 mΩ of typical RDS(on) each switch
– Insulation voltage UL certified of 2.5 kVrms
– Integrated NTC temperature sensor
– DBC Cu-Al2O3-Cu based
– Press-fit contact pins
DC+
DC+
G1
G3
S1
S3
Applications
T1
• DC/DC converter
AC1
AC2
T2
G2
G4
S2
S4
DC1-
DC2-
Description
This ACEPACK 2 power module in fourpack topology integrates advanced silicon carbide Power MOSFET technology from STMicroelectronics. The module leverages the innovative properties of the wide-bandgap SiC material and a high-thermalperformance substrate..
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | A2F1ACP |
CIT Relay |
CIT SWITCH | |
2 | A2F1ACQ |
CIT Relay |
CIT SWITCH | |
3 | A2F1ASP |
CIT Relay |
CIT SWITCH | |
4 | A2F1ASQ |
CIT Relay |
CIT SWITCH | |
5 | A2F1BCP |
CIT Relay |
CIT SWITCH | |
6 | A2F1BCQ |
CIT Relay |
CIT SWITCH | |
7 | A2F1BSP |
CIT Relay |
CIT SWITCH | |
8 | A2F1BSQ |
CIT Relay |
CIT SWITCH | |
9 | A2F1CCP |
CIT Relay |
CIT SWITCH | |
10 | A2F1CCQ |
CIT Relay |
CIT SWITCH | |
11 | A2F1CCQ12VDC1.9 |
CIT Relay |
CIT SWITCH | |
12 | A2F1CSP |
CIT Relay |
CIT SWITCH |