Advanced Technical Information HiPerFETTM Power MOSFETs Q-Class IXFK 60N55Q2 IXFX 60N55Q2 VDSS ID25 RDS(on) = = = 550 V 60 A 88 mΩ N-Channel Enhancement Mode Avalanche Rated, High dv/dt, Low Qg Low intrinsic Rg, low trr trr ≤ 250 ns Symbol VDSS VDGR VGS VGSM ID25 IDM IAR EAR EAS dv/dt PD TJ TJM Tstg TL Md Weight Test Conditions TJ = 25°C to 150°C TJ.
z
Symbol
Test Conditions
Characteristic Values (TJ = 25°C, unless otherwise specified) min. typ. max. 550 2.0 4.5 ± 200 TJ = 25°C TJ = 125°C 50 2 V V nA µA mA
z z
VDSS VGS(th) IGSS IDSS RDS(on)
VGS = 0 V, ID = 3mA VDS = VGS, ID = 8 mA VGS = ±20 VDC, VDS = 0 VDS = VDSS VGS = 0 V
z z
Double metal process for low gate resistance International standard packages Epoxy meet UL 94 V-0, flammability classification Avalanche energy and current rated Fast intrinsic Rectifier
Advantages
z z z
VGS = 10 V, ID = 0.5
• ID25 Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
88 m Ω
Easy to mount Space sav.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | 99016-1N2153 |
Microsemi Corporation |
Military Silicon Power Rectifier | |
2 | 990000006 |
toppoly |
TFT LCD | |
3 | 990000024 |
toppoly |
LTPS LCD | |
4 | 990000072 |
toppoly |
TFT LCD | |
5 | 990000475P |
TPO |
LTPS LCD | |
6 | 990001265 |
CHIMEI |
TFT LCD | |
7 | 99-3432-200-04 |
Binder |
Sensor connectors | |
8 | 99-3432-202-04 |
Franz Binder GmbH |
Female receptacle for PCB assembly scale drawing | |
9 | 99-3432-202-04 |
Binder |
Sensor connectors | |
10 | 99-3442-200-05 |
Binder |
Sensor connectors | |
11 | 99-3442-202-05 |
Binder |
Sensor connectors | |
12 | 9915H |
Advanced Power Electronics |
AP9915H |