Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-252 package is widely preferred for commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. The through-hole version (AP72T02GJ.
Dissipation Linear Derating Factor Single Pulse Avalanche Energy Avalanche Current Storage Temperature Range Operating Junction Temperature Range 29 24 -55 to 175 -55 to 175 Thermal Data Symbol Rthj-c Rthj-a Rthj-a . Maximum Thermal Resistance, Junction-case Maximum Thermal Resistance, Junction-ambient (PCB mount) 4 Value 2.5 62.5 110 Units ℃/W ℃/W ℃/W Maximum Thermal Resistance, Junction-ambient Data and specifications subject to change without notice 1 200807177 Free Datasheet http://www.datasheet-pdf.com/ AP72T02GH/J Electrical Characteristics@Tj=25oC(unless otherwise specified) Sy.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | 72T03GH |
Advanced Power Electronics |
AP72T03GH | |
2 | 72T36105 |
Renesas |
2.5 VOLT HIGH-SPEED FIFO | |
3 | 72T36115 |
Renesas |
2.5 VOLT HIGH-SPEED FIFO | |
4 | 72T36125 |
Renesas |
2.5 VOLT HIGH-SPEED FIFO | |
5 | 7200 |
TAISOX |
High Density Polyethylene | |
6 | 7200F |
TAISOX |
High Density Polyethylene | |
7 | 7201 |
ITT Industries |
Rocker and Lever Handle Switches | |
8 | 7201 |
Coto Technology |
7000 Series High Reliability Reed Relays | |
9 | 7201 |
Integrated Device Technology |
FIFO / Microcircuit | |
10 | 7203 |
RCA |
Beam Power Tube | |
11 | 7203 |
CPI |
Beam Power Tube | |
12 | 7209IPA |
Harris Corporation |
ICM7209IPA |