at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change witho.
Open NAND Flash Interface (ONFI) 3.0-compliant
Command set: ONFI NAND Flash Protocol
Multi-level cell (MLC) technology
Advanced command set:
Organization — Page size: 17,600 bytes (16,384 + 1216) — Block size: 512 pages, (8,192K + 608K bytes) — Plane size: 2 planes x 512 blocks
Device size: — 64 Gb: 1,024 blocks — 128Gb: 2,048 blocks — 256Gb: 4,096 blocks
Synchronous I/O performance — Up to timing mode 6 — Clock rate: 6ns — Read/write throughput per pin: 333 MT/s
Asynchronous I/O performance — Up to asynchronous timing mode 5 — tRC/tWC: 20ns (MIN) — Read/write throughput pe.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | 29F160BB |
STMicroelectronics |
Boot Block Single Supply Flash Memory | |
2 | 29F160BE |
Fujitsu Media Devices |
16M (2M X 8/1M X 16) BIT | |
3 | 29F160BT |
STMicroelectronics |
Boot Block Single Supply Flash Memory | |
4 | 29F160D |
AMD |
Boot Sector Flash Memory | |
5 | 29F160E |
Excel Semiconductor |
Boot Sector Flash Memory | |
6 | 29F160TE |
Fujitsu Media Devices |
16M (2M X 8/1M X 16) BIT | |
7 | 29F1610A |
Macronix International |
16M-BIT [2M x8/1M x16] CMOS SINGLE VOLTAGE FLASH EEPROM | |
8 | 29F16G08A |
Micron |
MT29F16G08A | |
9 | 29F16G08MAA |
Micron Technology |
MT29F16G08MAA | |
10 | 29F102BB |
ST Microelectronics |
MM29F102BB | |
11 | 29F001TPC |
Macronix International |
MX29F001TPC | |
12 | 29F002 |
STMicroelectronics |
2 Mbit 256Kb x8 / Boot Block Single Supply Flash Memory |