...... 5 2. FEATURES 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS.............
.. 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS..... 6 3.1 Pin Configuration SOIC / VSOP 208-mil . 6 3.2 Pad Configuration WSON 6x5-mm / 8X6-mm, XSON 4x4-mm . 6 3.3 Pin Configuration PDIP 300-mil ..
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | 25Q64BV |
Winbond |
W25Q64BV | |
2 | 25Q64BVAIG |
Winbond |
64M-BIT SERIAL FLASH MEMORY | |
3 | 25Q64BVAIP |
Winbond |
64M-BIT SERIAL FLASH MEMORY | |
4 | 25Q64BVFIG |
Winbond |
64M-BIT SERIAL FLASH MEMORY | |
5 | 25Q64BVFIP |
Winbond |
64M-BIT SERIAL FLASH MEMORY | |
6 | 25Q64BVIG |
Winbond |
64M-BIT SERIAL FLASH MEMORY | |
7 | 25Q64BVIP |
Winbond |
64M-BIT SERIAL FLASH MEMORY | |
8 | 25Q64BVSIG |
Winbond |
64M-BIT SERIAL FLASH MEMORY | |
9 | 25Q64BVSIP |
Winbond |
64M-BIT SERIAL FLASH MEMORY | |
10 | 25Q64CV |
Winbond |
W25Q64CV | |
11 | 25Q64CVAIG |
Winbond |
3V 64M-BIT SERIAL FLASH MEMORY | |
12 | 25Q64CVBIG |
Winbond |
3V 64M-BIT SERIAL FLASH MEMORY |