.............. 5 2. FEATURES ......... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........
... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS 6 3.1 Pad Configuration WSON 8x6-mm ..... 6 3.2 Pad Description WSON 8x6-mm . 6 3.3 Pin Configuration SOIC 300-mil .
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | 25Q01JVBIM |
Winbond |
3.0V 1G-BIT SERIAL FLASH MEMORY | |
2 | 25Q01JVIM |
Winbond |
3.0V 1G-BIT SERIAL FLASH MEMORY | |
3 | 25Q128BVBG |
Winbond |
3V 128M-BIT SERIAL FLASH MEMORY | |
4 | 25Q128BVBP |
Winbond |
3V 128M-BIT SERIAL FLASH MEMORY | |
5 | 25Q128BVCG |
Winbond |
3V 128M-BIT SERIAL FLASH MEMORY | |
6 | 25Q128BVCP |
Winbond |
3V 128M-BIT SERIAL FLASH MEMORY | |
7 | 25Q128BVEG |
Winbond |
3V 128M-BIT SERIAL FLASH MEMORY | |
8 | 25Q128BVEP |
Winbond |
3V 128M-BIT SERIAL FLASH MEMORY | |
9 | 25Q128BVFG |
Winbond |
3V 128M-BIT SERIAL FLASH MEMORY | |
10 | 25Q128BVFP |
Winbond |
3V 128M-BIT SERIAL FLASH MEMORY | |
11 | 25Q128FV |
Winbond |
W25Q128FV | |
12 | 25Q128FVBF |
Winbond |
3V 128M-BITSERIAL FLASH MEMORY |