The device is manufactured using Diffused Collector technology for more stable operation Vs base drive circuit variations resulting in very low worst case dissipation. ISOWATT218 INTERNAL SCHEMATIC DIAGRAM RBE =32 Ω Typ. ABSOLUTE MAXIMUM RATINGS Symbol V CES V CEO V EBO IC I CM IB P tot V isol T stg Tj April 2003 Parameter Collector-Emitter Voltage (V BE.
Storage Temperature Max. Operating Junction Temperature Value 1500 600 7 12 25 7 55 2500 -65 to 150 150 Unit V V V A A A W V o o C C 1/6 www.DataSheet4U.com ST2310DHI THERMAL DATA R thj-case Thermal Resistance Junction-case Max 2.3 o C/W ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified) Symbol I CES I EBO V (BR)EBO Parameter Collector Cut-off Current (V BE = 0) Emitter Cut-off Current (I C = 0) Emitter-Base Breakdown Voltage (I C = 0) Collector-Emitter Saturation Voltage Base-Emitter Saturation Voltage DC Current Gain Test Conditions V CE = 1500 V V CE = 1500 V V EB =.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | 2310-RC |
Bourns |
High Current Toroid Inductors | |
2 | 2310FX |
ST Microelectronics |
ST2310FX | |
3 | 2310HI |
STMicroelectronics |
ST2310HI | |
4 | 2311-RC |
Bourns |
High Current Toroid Inductors | |
5 | 2312-RC |
Bourns |
High Current Toroid Inductors | |
6 | 23128 |
Commodore |
128K STATIC READ ONLY MEMORY | |
7 | 2313-RC |
Bourns |
High Current Toroid Inductors | |
8 | 2314 |
H&M Semiconductor |
N-Channel Enhancement Mode Power MOSFET | |
9 | 2314-RC |
Bourns |
High Current Toroid Inductors | |
10 | 2315-RC |
Bourns |
High Current Toroid Inductors | |
11 | 23150 |
C&DTechnologies |
BobbinWoundSurfaceMountInductors | |
12 | 2316 |
Commodore |
STATIC READ ONLY MEMORY |