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H9TP32A4GDBCPR |
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| Part Number | H9TP32A4GDBCPR |
| Manufacturer | Hynix Semiconductor |
| Description | and is subject to change without notice. SK hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 0.3 / Jan. 2013 1 Preliminary H9TP32A4GDBCPR... |
| Features |
[ CI-MCP ] ● Operation Temperature - (-25)oC ~ 85oC ● Package - 162-ball FBGA - 11.5x13.0mm2, 1.0t, 0.5mm pitch - Lead & Halogen Free [ e-NAND ] [ LPDDR2 S4B ] ● Packaged NAND flash memory with MultiMediaCard interface ● e-NAND system specification, compliant with V4.41 ● Full backward compatibility with previous eNAND system specification ● Bus mode - High-speed eMMC protocol. - Three different data bus widths: 1 bit, 4 bits,8 bits. - Data transfer rate: up to 104Mbyte/s - DDR mode supported ● Operating voltage range: - VCCQ = 3.3/1.8V - VCC = 3.3V ● Error free memory access - Internal er... |
| Document |
 H9TP32A4GDBCPR Data Sheet
PDF 2.66MB |
| Distributor | Stock | Price | Buy |
|---|
| No. | Parte # | Fabricante | Descripción | Hoja de Datos |
|---|---|---|---|---|
| 1 | H9TKNNN8KDMPQR |
Hynix Semiconductor |
LPDDR2-S4B 8Gb |
|
| 2 | H9TQ17ABJTMCUR |
Hynix Semiconductor |
16GB eNAND (x8) / LPDDR3 16Gb(x32) |
|
| 3 | H9TQ17ABJTMCUR-KTM |
Hynix Semiconductor |
16GB eNAND (x8) / LPDDR3 16Gb(x32) |
|
| 4 | H9TQ17ABJTMCUR-KUM |
Hynix Semiconductor |
16GB eNAND (x8) / LPDDR3 16Gb(x32) |
|
| 5 | H9001-01 |
HARWIN |
TERMINAL LUG |
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