GC1306 Microsemi Corporation ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES Datasheet, en stock, prix

logo
Recherchez avec le numéro de pièce ainsi que le fabricant ou la description

GC1306

Microsemi Corporation
GC1306
GC1306 GC1306
zoom Click to view a larger image
Part Number GC1306
Manufacturer Microsemi (https://www.microsemi.com/) Corporation
Description KEY FEATURES !" Frequencies from VHF to 6 GHz !" Lower Parasitics !" Mil Grade Ceramic/Epoxy Amalgam Construction !" Dense SiO2 Junction Passivation !" Superior Consistency/Repeatability !" Footprint...
Features !" Frequencies from VHF to 6 GHz !" Lower Parasitics !" Mil Grade Ceramic/Epoxy Amalgam Construction !" Dense SiO2 Junction Passivation !" Superior Consistency/Repeatability !" Footprints Available for SOT-23/SOD-323/SOD-123 !" Priced for Commercial Products !" Tape & Reel for Volume Pick & Place APPLICATIONS/BENEFITS APPLICATIONS/BENEFIT S !" High performance wireless surface mounting including: !" GSM !" TAGS !" WANS !" PCS !" AMPS !" DECT !" CELLULAR W W W . Microsemi . COM Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsi...

Document Datasheet GC1306 Data Sheet
PDF 290.20KB
Distributor Stock Price Buy

Similar Datasheet

No. Partie # Fabricant Description Fiche Technique
1 GC1300
Microsemi Corporation
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES Datasheet
2 GC1301
Microsemi Corporation
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES Datasheet
3 GC1302
Microsemi Corporation
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES Datasheet
4 GC1303
Microsemi Corporation
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES Datasheet
5 GC1304
Microsemi Corporation
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES Datasheet
More datasheet from Microsemi Corporation



Depuis 2018 :: D4U Semiconductor :: (Politique de confidentialité et contact