MT29F64G08CECCB |
Part Number | MT29F64G08CECCB |
Manufacturer | Micron |
Description | only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such pr... |
Features |
• Trench MOS Schottky technology • Low forward voltage drop, low power losses • High efficiency operation • Low thermal resistance 2 VTS40100CT PIN 1 PIN 3 PIN 2 CASE 3 1 VF40100C PIN 1 PIN 3 PIN 2 2 3 1 • Meets MSL level 1, per J-STD-020C, LF max peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 seconds (for TO-220AB, ITO-220AB & TO-262AA package) • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC TYPICAL APPLICATIONS TO-263AB K K TO-262AA 2 1 1 VB40100C PIN 1 PIN 2 K HEATSINK 2 3 For use in high frequency inverters, switching power supplies, free-wheelin... |
Document |
MT29F64G08CECCB Data Sheet
PDF 3.14MB |
Distributor | Stock | Price | Buy |
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No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | MT29F64G08CECBB |
Micron |
NAND Flash Memory | |
2 | MT29F64G08CEAAA |
Micron |
NAND Flash Memory | |
3 | MT29F64G08CEACA |
Micron |
NAND Flash Memory | |
4 | MT29F64G08CABA |
Micron |
NAND Flash Memory | |
5 | MT29F64G08CBAAA |
Micron |
NAND Flash Memory |