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MPC8300 |
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| Part Number | MPC8300 |
| Manufacturer | Microsemi (https://www.microsemi.com/) |
| Description | KEY FEATURES Low parasitics LP = 0.02nH Typical CP = 0.04pF Typical Surface Mount design Broadband Performance through X-Band Available on Tape & Reel for automated pick & place assembly Sm... |
| Features |
Low parasitics LP = 0.02nH Typical CP = 0.04pF Typical Surface Mount design Broadband Performance through X-Band Available on Tape & Reel for automated pick & place assembly Small, SOD 323 Footprint This series of surface mount capacitors utilize new and unique monolithic MMSM® technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled. The package parasitics provide smooth non-resonant functiona... |
| Document |
 MPC8300 Data Sheet
PDF 433.00KB |
| Distributor | Stock | Price | Buy |
|---|
| No. | Parte # | Fabricante | Descripción | Hoja de Datos |
|---|---|---|---|---|
| 1 | MPC8306S |
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| 2 | MPC8308 |
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| 3 | MPC8309 |
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| 4 | MPC8309 |
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| 5 | MPC8313E |
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