WED3C755E8M-XBX White Electronic Designs Corporation RISC MICROPROCESSOR MULTI-CHIP PACKAGE Datasheet, en stock, prix

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WED3C755E8M-XBX

White Electronic Designs Corporation
WED3C755E8M-XBX
WED3C755E8M-XBX WED3C755E8M-XBX
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Part Number WED3C755E8M-XBX
Manufacturer White Electronic Designs Corporation
Description www.DataSheet4U.com White Electronic Designs WED3C755E8M-XBX RISC MICROPROCESSOR MULTI-CHIP PACKAGE OVERVIEW The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive,...
Features doze, nap, sleep and dynamic power management. The WED3C755E8M-XBX multichip package consists of: 755 RISC processor (E die revision) Dedicated 1MB SSRAM L2 cache, configured as 128Kx72 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA) Core Frequency/L2 Cache Frequency (300MHz/ 150MHz, 350MHz/175MHz) Maximum 60x Bus frequency = 66MHz FEATURES The WED3C755E8M-XBX is offered in Commercial (0°C to +70°C), industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight computers, fire control systems and rugg...

Document Datasheet WED3C755E8M-XBX Data Sheet
PDF 377.53KB
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