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Features
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junction - soldering point SMD version, device on PCB: @ min. footprint @ 6 cm2 cooling area 1)
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30 110 -
-70
K/W
Soldering temperature, 1.6 mm (0.063 in.) from case for 10s
Tsold
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260
°C
Electrical Characteristics, at Tj=25°C unless otherwise specified Parameter Symbol Conditions min. Drain-source breakdown voltage V(BR)DSS VGS=0V, ID=0.25mA Drain-Source avalanche breakdown voltage Gate threshold voltage Zero gate voltage drain current VGS(th) IDSS
ID=80µΑ, VGS=VDS VDS=600V, VGS=0V, Tj=25°C, Tj=150°C
Values typ. 700 4.5 0.5 2.5 6.8 max. 5.5 600 3.5 -
Unit V
V(BR)DS VGS=0V, ...
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02N60S5 Data Sheet
