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AN555 |
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| Part Number | AN555 |
| Manufacturer | Motorola |
| Description | OF THE SOE PACKAGE Figure 2 displays the component parts on a stud-mounted SOE package. This package will be used as an example since both the stud and flange-mounted packages are very Figure 1. SOE ... |
| Features |
was chosen due to its high thermal conductivity. Attached to the bottom of the disc is a copper stud which is for heat transfer and mechanical mounting. The lead frame is attached to a metalized pattern on to the top surface of the BeO disc. The actual shape of the leads differs between the various package types. Finally an Alumina ceramic cap is attached to the top of the disc over the leads providing a protective cover for the transistor die. An understanding of the basic structure of the SOE package is essential to proper usage of these devices in respect to heat-sinking and mechanical mou... |
| Document |
 AN555 Data Sheet
PDF 143.22KB |
| Distributor | Stock | Price | Buy |
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|---|---|---|---|---|
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| 3 | AN5515 |
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| 4 | AN552 |
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| 5 | AN5520 |
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