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RMPA2266 |
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| Part Number | RMPA2266 |
| Manufacturer | Fairchild Semiconductor |
| Description | ■ ■ ■ The RMPA2266 Power Amplifier Module (PAM) is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA +16dBm Pout applications. Answering the call for ultr... |
| Features |
■ 40% WCDMA efficiency at +28dBm Pout ■ 20% WCDMA efficiency (58mA total current) at ■ ■ ■ ■ tm General Description ■ ■ ■ The RMPA2266 Power Amplifier Module (PAM) is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA +16dBm Pout applications. Answering the call for ultra-low DC power Low quiescent current (Iccq): 25mA in low-power consumption and extended battery life in portable mode electronics, the RMPA2266 uses novel proprietary Meets UMTS/WCDMA performance requirements circuitry to dramatically reduce amplifier current at low to Meets HSDPA per... |
| Document |
 RMPA2266 Data Sheet
PDF 222.07KB |
| Distributor | Stock | Price | Buy |
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| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
| 1 | RMPA2263 |
Fairchild Semiconductor |
WCDMA Power Amplifier Module |
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| 2 | RMPA2265 |
Fairchild Semiconductor |
Dual Band WCDMA Power Amplifier Module 1850 to 1910 MHz and 1920 to 1980 MHz |
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| 3 | RMPA2450 |
Fairchild Semiconductor |
2.4-2.5 GHz GaAs MMIC Power Amplifier |
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| 4 | RMPA2458 |
Fairchild Semiconductor |
InGaP HBT Low Current Linear Power Amplifier |
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| 5 | RMPA2550 |
Fairchild Semiconductor |
2.4-2.5 GHz and 5.15-5.85 GHz Dual Band InGaP HBT Linear Power Amplifier |
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