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DIP40 |
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| Part Number | DIP40 |
| Manufacturer | STMicroelectronics (https://www.st.com/) |
| Description | Thermal Data DIP 40 40 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0... |
| Features |
... |
| Document |
 DIP40 Data Sheet
PDF 29.95KB |
| Distributor | Stock | Price | Buy |
|---|
| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
| 1 | DIP-14 |
Saga |
DIP-14 |
|
| 2 | DIP-8 |
Advanced Analogic Technologies |
DUAL OPERATIONAL AMPLIFIERS |
|
| 3 | DIP-8 |
Advanced Analogic Technologies |
DUAL LOW NOISE OPERATIONAL AMPLIFIERS |
|
| 4 | DIP05-1Axx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays |
|
| 5 | DIP05-1Bxx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays |
|