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IX150T06M-AG |
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| Part Number | IX150T06M-AG |
| Manufacturer | IXYS |
| Description | Trench XPT IGBT Chip IX150T06M-AG tentative Type VCE [V] IX150T06M-AG 650 IC Chip Size Package [A] [mm] x [mm] 300 14.2 10.6 sawn on foil unsawn wafer in waffle pack Ordering Code tbd ... |
| Features |
/ Advantages:
● Easy paralleling due to the positive temperature coefficient of the on-state voltage ● Rugged Trench XPT design (Xtreme light Punch Through) results in: - short circuit rated for 10 µsec. - very low gate charge - square RBSOA @ 2x Ic - low EMI - Tvjm = 175°C ● Thin wafer technology combined with the XPT design results in a competitive low Vce(sat) ● Solderable/sinterable frontside metallization for highly reliable interconnection technology Mechanical Parameters Applications: ● AC motor drives ● Solar inverter ● Medical equipment ● Uninterruptible power supply ● Air-conditioni... |
| Document |
 IX150T06M-AG Data Sheet
PDF 69.47KB |
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