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H32N65DM6 |
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| Part Number | H32N65DM6 |
| Manufacturer | STMicroelectronics (https://www.st.com/) |
| Description | This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the AC... |
| Features |
Order code SH32N65DM6AG
VDS 650 V
RDS(on) max. 97 mΩ
ID 32 A
• AQG 324 qualified • Half-bridge power module • 650 V blocking voltage • Fast recovery body diode • Very low switching energies • Low package inductance • Dice on direct bond copper (DBC) substrate • Low thermal resistance • Isolation rating of 3.4 kVrms/min Applications • Switching applications Description This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers... |
| Document |
 H32N65DM6 Data Sheet
PDF 471.55KB |
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