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Features
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Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Low power loss, high efficiency. High current capability, low forward voltage drop. High surge capability Guarding for overvoltage protection Ultra high-speed switching Silicon epitaxial planar chip, metal silicon junction Lead-free parts meet environmental standards of MIL-STD-19500 /228
SOD-123HT
MECHANICAL DATA
Epoxy:UL94-V0 rated flame retardant Case : Molded plastic, SOD-123HT Terminals : Solder plated, ...
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SM3100HT Data Sheet
