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Features
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Low profile package Low power losses, high efficiency High surge current capability
Cavity-free glass-passivated junction Low forward voltage drop Solder dip 260ºC, 10s AEC-Q101 qualified Fast switching for high efficiency Component in accordance to RoHS 2011/65/EU
and WEEE 2002/96/EC Meets MSL level 1, per J-STD-020, LF maximum
peak of 260º C
MECHANICAL DATA Case: P-6. Epoxy meets UL 94V-0 flammability
rating. Polarity: Color band denotes cathode end. Terminals: Matte tin plated leads, solderable per
MIL-STD-750 Method 2026, J-STD-002 and JESD22-B102. Consumer grade,...
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RGP50B Data Sheet
