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BZG03-C47 |
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| Part Number | BZG03-C47 |
| Manufacturer | NXP (https://www.nxp.com/) |
| Description | DO-214AC surface mountable package with glass passivated chip. BZG03 series The well-defined void-free case is of a transfer-moulded thermo-setting plastic. handbook, 4 columns Fig.1 Simplified out... |
| Features |
• Glass passivatedb • High maximum operating temperature • Low leakage current • Excellent stability • UL 94V-O classified plastic package • Zener working voltage range: 10 to 270 V for 35 types • Supplied in 12 mm embossed tape. DESCRIPTION DO-214AC surface mountable package with glass passivated chip. BZG03 series The well-defined void-free case is of a transfer-moulded thermo-setting plastic. handbook, 4 columns Fig.1 Simplified outline (DO-214AC; SOD106) and symbol. ,, ,, ,, k cathode band a Top view Side view MSA473 LIMITING VALUES In accordance with the Absolute Maximum Rating S... |
| Document |
 BZG03-C47 Data Sheet
PDF 31.55KB |
| Distributor | Stock | Price | Buy |
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