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BZG01-C33 |
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| Part Number | BZG01-C33 |
| Manufacturer | NXP (https://www.nxp.com/) |
| Description | DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. The small rectangular package has two J bent leads. cat... |
| Features |
• Glass passivated • High maximum operating temperature • Ideal for surface mount automotive applications • Low leakage current • Excellent stability • UL 94V-O classified plastic package • Zener working voltage range: 10 to 270 V for 35 types • Supplied in 12 mm embossed tape and reel, 1500 and 7500 pieces • Marking: cathode, date code, type name • Easy pick and place. Top view olumns BZG01 series DESCRIPTION DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. The small rectangular package has two J b... |
| Document |
 BZG01-C33 Data Sheet
PDF 50.60KB |
| Distributor | Stock | Price | Buy |
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| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
| 1 | BZG01-C30 |
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| 2 | BZG01-C36 |
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| 3 | BZG01-C39 |
NXP |
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| 4 | BZG01-C10 |
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| 5 | BZG01-C100 |
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