No. | Partie # | Fabricant | Description | Fiche Technique |
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JCET |
SCHOTTKY BARRIER DIODE Small Surface Mounting Type Low VF High Reliability APPLICATIONS Low Power Rectification MARKING: D3C SOT-23 Solid dot = Green molding compound device,if none, the normal device. MAXIMUM RATINGS ( Ta=25℃ unless otherwise noted ) Symbol P |
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Micro Commercial Components |
40 Volts 0.1 Amp Surface Mount Schottky Barrier Diode • • • omponents 21201 Itasca Street Chatsworth !"# $ % !"# RB421D Low VF ( VF=0.45V Typ at 100mA ) High reliability Small surface mounting type ( SMD3 ) 0.1 Amp Surface Mo |
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Rohm |
Schottky barrier diode 1) Small mold type. (SMD3) 2) Low IR 3) High reliability. Construction Silicon epitaxial planer 2.9±0.2 リードとも 0.4 +-00..105 Eachlead has same dimension (3) +0.1 0 .15 -0.06 0.95 2.8±0.2 1. 6-+00..12 (2) 0.95 0.95 1.9±0.2 (1) 0~ 0.1 0 .8±0 |
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Transys |
Schottky barrier Diodes z Small surface mounting type z Low reverse current and low forward voltage z High reliability Marking: D3C SOT-23-3L + - 1. 02 2. 80¡ À0. 05 1. 60¡ À0. 05 0. 95¡ À0. 025 1. 9 Maximum Ratings and Electrical Characteristics, Single Diode @TA=25 |
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Kexin |
Schottky Diode ● Small surface mounting type ● Low reverse current and low forward voltage ● High reliability +0.12.4 -0.1 SOT-23 2.9 +0.1 -0.1 0.4 +0.1 -0.1 3 12 0.95 +0.1 -0.1 1.9 +0.1 -0.1 +0.11.3 -0.1 0.55 0.4 Diodes Unit: mm 0.1 +0.05 -0.01 +0.10.97 -0. |
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WEJ |
Schottky barrier Diodes z Small surface mounting type z Low reverse current and low forward voltage z High reliability Marking: D3C Maximum Ratings and Electrical Characteristics, Single Diode @TA=25℃ Parameter ICPeak reverse voltage NDC reverse voltage Mean rectifying cu |
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ROHM |
Schottky Barrier Diode High reliability Small mold type Super Low VF ●Inner Circuit ●Application ●Packaging Specifications Small current rectification Packing Embossed Tape Reel Size(mm) 180 ●Structure Taping Width(mm) 8 Basic Ordering |
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