| No. | Partie # | Fabricant | Description | Fiche Technique |
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PAN JIT |
SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EU directive) MECHANICAL DATA • Case: Molded Glass MICRO-MELF • Terminals: Soldera |
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UPM |
SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se |
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UPM |
SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se |
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PAN JIT |
SURFACE MOUNT ZENER DIODES • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EU directive) MECHANICAL DATA • Case: Molded Glass MICRO-MELF • Terminals: Soldera |
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