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MAX17521 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Synchronous Step-Down DC-DC Converter - Maxim Integrated

भाग संख्या MAX17521
समारोह Synchronous Step-Down DC-DC Converter
मैन्युफैक्चरर्स Maxim Integrated 
लोगो Maxim Integrated लोगो 
पूर्व दर्शन
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<?=MAX17521?> डेटा पत्रक पीडीएफ

MAX17521 pdf
MAX17521
60V, 1A, Dual-Output, High-Efficiency,
Synchronous Step-Down DC-DC Converter
Absolute Maximum Ratings
VIN_ to PGND_.......................................................-0.3V to +65V
EN/UVLO_ to SGND_.............................. -0.3V to (VIN_ + 0.3V)
LX_ to PGND_......................................... -0.3V to (VIN_ + 0.3V)
FB_, RESET_, FSEL, MODE_,
COMP_, VCC_, SYNC, SS_ to SGND_...............-0.3V to +6V
SGND_ to PGND_................................................-0.3V to +0.3V
LX Total RMS Current.........................................................±1.6A
Continuous Power Dissipation (TA = +70°C)
(derate 28.6mW/°C above +70°C)
(multilayer board).....................................................2285.7mW
Output Short-Circuit Duration.....................................Continuous
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +160°C
Lead Temperature (soldering, 10s).................................. +300°C
Soldering Temperature (reflow)........................................+260°C
Note 1: Junction temperature greater than +125°C degrades operating lifetimes.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
PACKAGE TYPE: 24-PIN TQFN
Package Code
Outline Number
Land Pattern Number
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θJA)
Junction to Case (θJC)
T2445+1C
21-0201
90-0083
35°C/W
1.8°C/W
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VIN_ = +24V, VSGND_ = VPGND_ = VFSEL = 0V, CIN_ = 2.2μF, CVCC_ = 1μF, VEN/UVLO_ = 1.5V, CSS_ = 0.01μF, FB_ = 0.98 x VFB-REG,
COMP_ = unconnected, LX_ = unconnected, RESET_ = unconnected. TA = -40°C to +125°C, unless otherwise noted. Typical values
are at TA = +25°C. All voltages are referenced to SGND_, unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
INPUT SUPPLY (VIN)
Input Voltage Range
V­IN_
4.5 60 V
Input Shutdown Current
IIN-SH
VEN_ = 0V, shutdown mode
1 3.5 µA
Input Switching Current
IQ_PFM_
IQ_PWM_
VMODE_> 2V
VMODE_< 0.8V,
VCOMP_ = 0.8V
VFSEL > 2V
VFSEL < 0.8V
135 260
5
3.7
µA
mA
www.maximintegrated.com
Maxim Integrated 2

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