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MAX8855A डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - 2MHz Step-Down Regulators - Maxim

भाग संख्या MAX8855A
समारोह 2MHz Step-Down Regulators
मैन्युफैक्चरर्स Maxim 
लोगो Maxim लोगो 
पूर्व दर्शन
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<?=MAX8855A?> डेटा पत्रक पीडीएफ

MAX8855A pdf
Dual, 5A, 2MHz Step-Down Regulators
ABSOLUTE MAXIMUM RATINGS
IN_, LX_, VDD, VDL, PWRGD_ to GND..................-0.3V to +4.5V
VDD, VDL to IN_.....................................................-0.3V to +4.5V
EN_, SS_, COMP_, FB_, REFIN, FSYNC to GND ......-0.3V to the
lower of (VVDD + 0.3V) and (VVDL + 0.3V)
Continuous LX_ Current (Note 1) ...................................5.5ARMS
BST_ to LX_ ...........................................................-0.3V to +4.5V
PGND_ to GND......................................................-0.3V to +0.3V
Continuous Power Dissipation (TA = +70°C)
32-Pin TQFN (5mm x 5mm)
(derate 34.5mW/°C above +70°C) ..........................2758.6mW
Operating Ambient Temperature Range .............-40°C to +85°C
Operating Junction Temperature Range ...........-40°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Note 1: LX_ have internal clamp diodes to PGND_ and IN_. Applications that forward bias these diodes should take care not to
exceed the IC’s package power-dissipation limits.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
TQFN
Junction-to-Ambient Thermal Resistance (θJA) ...........29°C/W
Junction-to-Case Thermal Resistance (θJC) ...............1.7°C/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VIN_ = VVDD = VVDL = 3.3V, VFB_ = 0.5V, VSS_ = VREFIN = 600mV, PGND_ = GND, RFSYNC = 10kΩ, L = 0.47μH, CBST_ = 0.1μF,
CSS_ = 0.022μF, PWRGD_ not connected; TA = -40°C to +85°C, typical values are at TA = +25°C, unless otherwise noted.) (Note 2)
PARAMETER
IN1, IN2, VDL, VDD
IN_, VDL, and VDD Voltage Range
IN_ Supply Current
VDD + VDL Supply Current
Shutdown Supply Current
(IIN1 + IIN2 + IVDD + IVDL)
IN_, VDD Undervoltage Lockout Threshold
UVLO Monitors VDD, IN1, and IN2
IN_, VDD Undervoltage Lockout Deglitch
BST1, BST2
Shutdown BST_ Current
COMP1, COMP2
COMP_ Clamp Voltage, High
COMP_ Slew Rate
COMP_ Shutdown Resistance
CONDITIONS
MIN
(Note 3)
MAX8855
MAX8855A
1MHz switching, no load
1MHz switching, VDD = VDL
VIN_ = VVDD = VVDL = VBST_ -
VLX_ = 3.6V, VEN_ = 0V
Rising
VIN_ = 2.5V
VIN_ = 3.3V
VVDD = 2.5V
VVDD = 3.3V
TA = +25°C
TA = +85°C
Falling
2.35
2.25
1.8
VIN_ = VVDD = VVDL = VBST_ = TA = +25°C
3.6V, VEN_ = 0V, VLX_ = 0 or 3.6V TA = +85°C
VVDD = VIN_ = 2.25V to 3.6V, VFB_ = 0.7V
From COMP_ to GND, VEN_ = 0V
1.80
TYP MAX UNITS
3.60
V
3.60
1.9 3.5
mA
2.8 5
7.2
mA
10 15
11
0.3
μA
2.0 2.2
1.9
V
2 μs
2
0.02
μA
2.00 2.25
V
1.40 V/μs
7 25 Ω
2 _______________________________________________________________________________________
Free Datasheet http://www.datasheet-pdf.com/

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