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BL2012-10B2450 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Multilayer Chip Baluns - Advanced Ceramic X

भाग संख्या BL2012-10B2450
समारोह Multilayer Chip Baluns
मैन्युफैक्चरर्स Advanced Ceramic X 
लोगो Advanced Ceramic X लोगो 
पूर्व दर्शन
1 Page
		
<?=BL2012-10B2450?> डेटा पत्रक पीडीएफ

BL2012-10B2450 pdf
Dimensions and Recommended PC Board Pattern
a
p
ACX
Advanced Ceramic X
Unit : mm
Mark
Dimensions
W
T
c
L gb
L
2.0
0.1
W
1.25
0.1
T
0.95
0.1
a
0.3
0.1
b
0.2
0.1
c
0.3+0.1
/-0.2
g
0.35
0.1
p
0.65
0.05
Without DC feed
0.35
*
0.8
*
1.0
*
0.30
With DC feed
0.35
Solder Resist
Land
Through-hole (0.3)
*
0.8
*
0.30
*
1.0
Solder Resist
Land
Through-hole (0.3)
* Line width should be designed to match 50characteristic impedance, depending on PCB
material and thickness.
** By-pass capacitor should be connected when feeding DC power.
BL2012-10B2450T/LF REV:2 PAGE:2/7

विन्यास 7 पेज
डाउनलोड[ BL2012-10B2450 Datasheet.PDF ]


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अनुशंसा डेटापत्रक

भाग संख्याविवरणविनिर्माण
BL2012-10B2450Multilayer Chip BalunsAdvanced Ceramic X
Advanced Ceramic X


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