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MAX17530 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Synchronous Step-Down DC-DC Converter - Maxim Integrated Products

भाग संख्या MAX17530
समारोह Synchronous Step-Down DC-DC Converter
मैन्युफैक्चरर्स Maxim Integrated Products 
लोगो Maxim Integrated Products लोगो 
पूर्व दर्शन
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<?=MAX17530?> डेटा पत्रक पीडीएफ

MAX17530 pdf
MAX17530
4V to 42V, 25mA, Ultra-Small, High-Efficiency
Synchronous Step-Down DC-DC Converter
with 22µA No-Load Supply Current
Absolute Maximum Ratings
IN, EN/UVLO, VOUT, RESET to GND.....................-0.3V to 48V
LX to GND....................................................... -0.3V to IN + 0.3V
RT/SYNC, SS, FB, MODE to GND............................-0.3V to 6V
LX Total RMS Current.........................................................±0.8A
Output Short-Circuit Duration.....................................Continuous
Continuous Power Dissipation (TA = +70°C)
TDFN (derate 14.9mW/°C above +70°C) ............... 1188.7mW
µMAX (derate 8.8mW/°C above +70°C)...................707.3mW
Operating Temperature Range (Note 1)............ -40°C to +125°C
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................. +300°C
Soldering Temperature (reflow)........................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Note 1: Junction temperature greater than +125°C degrades operating lifetimes.
Package Information
PACKAGE TYPE: 10 TDFN
Package Code
Outline Number
Land Pattern Number
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θJA)
Junction to Case (θJC)
T1032N+1
21-0429
90-0082
67.3°C/W
18.2°C/W
PACKAGE TYPE: 10 µMAX
Package Code
Outline Number
Land Pattern Number
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θJA)
Junction to Case (θJC)
U10+5
21-0061
90-0330
113.1°C/W
42°C/W
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
www.maximintegrated.com
Maxim Integrated 2

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डाउनलोड[ MAX17530 Datasheet.PDF ]


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