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UP6281 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - 12V MOSFET Drivers - uPI Semiconductor

भाग संख्या UP6281
समारोह 12V MOSFET Drivers
मैन्युफैक्चरर्स uPI Semiconductor 
लोगो uPI Semiconductor लोगो 
पूर्व दर्शन
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<?=UP6281?> डेटा पत्रक पीडीएफ

UP6281 pdf
VCC
OD#
PWM
UVLO
Output
Disable
uP6281
Functional Block Diagram
Adaptive
Shoot-Through
Protection
BOOT
UGATE
PHASE
Adaptive
Shoot-Through
Protection
VCC
LGATE
GND
Functional Pin Description
No. Pin Name Pin Function
Bootstrap Supply for the floating upper gate driver. Connect the bootstrap capacitor CBOOT
1 BOOT between BOOT pin and the PHASE pin to form a bootstrap circuit. The bootstrap capacitor
provides the charge to turn on the upper MOSFET. Ensure that CBOOT is placed near the IC.
2 PWM PWM Input. This pin receives logic level input and controls the driver outputs.
3
OD#
Output Disable. This pin disables normal operation and forces both UGATE and LGATE off
when it is pulled low.
4
VCC
Supply Voltage for the IC. This pin provides bias voltage for the IC. Connect this pin to 12V
voltage source and bypass it with an R/C filter.
Lower Gate Driver Output. Connect this pin to the gate of lower MOSFET. This pin is
5 LGATE monitored by the adaptive shoot-through protection circuitry to determine when the lower
MOSFET has turn off.
6 GND Ground for the IC. All voltages levels are measured with respect to this pin.
PHASE Switch Node. Connect this pin to the source of the upper MOSFET and the drain of
the lower MOSFET. This pin is used as the sink for the UGATE driver. This pin is also monitored
7 PHASE by the adaptive shoot-through protection circuitry to determine when the upper MOSFET has
turned off. A Schottky diode between this pin and ground is recommended to reduce negative
transient voltage which is common in a power supply system.
8 UGATE
Exposed Pad
(GND)
Upper Gate Driver Output. Connect this pin to the gate of upper MOSFET. This pin is
monitored by the adaptive shoot-through protection circuitry to determine when the upper
MOSFET has turned off.
Ground for the IC. The exposed pad should be well soldered to PCB for effective heat
conduction.
uPI Semiconductor Corp., http://www.upi-semi.com
Rev. F03, File Name: uP6281-DS-F0300
2
Free Datasheet http://www.Datasheet4U.com

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