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MAX17503 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Synchronous Step-Down DC-DC Converter - Maxim

भाग संख्या MAX17503
समारोह Synchronous Step-Down DC-DC Converter
मैन्युफैक्चरर्स Maxim 
लोगो Maxim लोगो 
पूर्व दर्शन
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<?=MAX17503?> डेटा पत्रक पीडीएफ

MAX17503 pdf
MAX17503
4.5V-60V, 2.5A, High-Efficiency,
Synchronous Step-Down DC-DC Converter
With Internal Compensation
Absolute Maximum Ratings (Note 1)
VIN to PGND..........................................................-0.3V to +65V
EN/UVLO to SGND................................................-0.3V to +65V
LX to PGND................................................-0.3V to (VIN + 0.3V)
BST to PGND.........................................................-0.3V to +70V
BST to LX..............................................................-0.3V to +6.5V
BST to VCC............................................................-0.3V to +65V
CF, RESET, SS, MODE, SYNC,
RT to SGND......................................................-0.3V to +6.5V
FB to SGND..........................................................-0.3V to +1.5V
VCC to SGND........................................................-0.3V to +6.5V
SGND to PGND.....................................................-0.3V to +0.3V
LX Total RMS Current............................................................±4A
Output Short-Circuit Duration.....................................Continuous
Continuous Power Dissipation (TA = +70ºC) (multilayer board)
TQFN (derate 30.3mW/ºC above TA = +70ºC).......2424.2mW
Junction Temperature....................................................... +150ºC
Storage Temperature Range..............................-65NC to +160ºC
Lead Temperature (soldering, 10s).................................. +300ºC
Soldering Temperature (reflow)........................................ +260ºC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any
other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Note 1: Junction temperature greater than +125°C degrades operating lifetimes.
Package Information
PACKAGE TYPE: 20 TQFN
Package Code
Outline Number
Land Pattern Number
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θJA)
Junction to Case (θJC)
T2044+4
21-0139
90-0409
33°C/W
2°C/W
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Electrical Characteristics
(VIN = VEN/UVLO = 24V, RRT = 40.2kI (500kHz), CVCC = 2.2μF, VPGND = VSGND = VMODE = VSYNC = 0V, LX = SS = RESET =
open, VBST to VLX = 5V, VFB = 1V, TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C. All voltages are
referenced to SGND, unless otherwise noted.) (Note 2)
PARAMETER
INPUT SUPPLY (VIN)
Input Voltage Range
Input Shutdown Current
Input Quiescent Current
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
VIN
IIN-SH
IQ_PFM
IQ-DCM
IQ_PWM
VEN/UVLO = 0V (shutdown mode)
VFB = 1V, MODE = RT = open
VFB = 1V, MODE = open
DCM mode, VLX = 0.1V
Normal switching mode, fSW = 500kHz, VFB
= 0.8V
4.5
2.8
118
162
1.16
9.5
60
4.5
1.8
V
µA
mA
www.maximintegrated.com
Maxim Integrated 2

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