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MAX17599 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - (MAX17598 / MAX17599) Active Clamp Current-Mode PWM Controllers - Maxim Integrated Products

भाग संख्या MAX17599
समारोह (MAX17598 / MAX17599) Active Clamp Current-Mode PWM Controllers
मैन्युफैक्चरर्स Maxim Integrated Products 
लोगो Maxim Integrated Products लोगो 
पूर्व दर्शन
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<?=MAX17599?> डेटा पत्रक पीडीएफ

MAX17599 pdf
MAX17598/MAX17599
Low IQ, Wide-Input Range, Active Clamp
Current-Mode PWM Controllers
ABSOLUTE MAXIMUM RATINGS
VIN (MAX17599 only).............................................-0.3V to +40V
VDRV to SGND
(MAX17598 Only)...............................................-0.3V to +16V
(MAX17599 Only).................................................-0.3V to +6V
EN/UVLO to SGND......................................-0.3V to (VIN + 0.3V)
NDRV, AUXDRV to PGND........................-0.3V to (VDRV + 0.3V)
OVI, RT, DITHER, COMP, SS, FB,
SLOPE, DT to SGND...........................................-0.3V to +6V
CS to SGND.............................................................-0.8V to +6V
PGND to SGND.....................................................-0.3V to +0.3V
Maximum Input /Output Current (Continuous)
VIN, VDRV.......................................................................100mA
NDRV (pulsed for less than 100ns)..........................+0.9A/-1.5A
AUXDRV (pulsed for less than 100ns)......................+0.3A/-0.7A
Continuous Power Dissipation (TA = +70NC)
TQFN (derate 20.8mW/°C above 70°C).....................1666mW
Operating Temperature Range......................... -40°C to +125°C
Maximum Junction Temperature......................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
Soldering Temperature (reflow).......................................+260°C
PACKAGE THERMAL CHARACTERISTICS
TQFN
Junction-to-Case Thermal Resistance (qJC)..................7°C/W
Junction-to-Ambient Thermal Resistance (qJA)...........48°C/W
(Note 1)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VIN = 12V (for MAX17598, bring VIN up to 21V for startup), VCS = VDITHER = VFB = VOVI = VSGND = VPGND = 0V, VEN/UVLO = +2V,
AUXDRV = NDRV = SS = COMP = SLOPE = unconnected, RRT = 25kI, RDT = 10kI, CVIN = 1FF, CVDRV = 1FF, TA = TJ = -40NC to
+125NC, unless otherwise noted. Typical values are at TA = TJ = +25NC.) (Note 2)
PARAMETER
INPUT SUPPLY (VIN)
VIN Voltage Range
VIN Bootstrap UVLO Wakeup
VIN Bootstrap UVLO
Shutdown Level
VIN Supply Startup Current
(under UVLO)
VIN Supply Shutdown
Current
VIN Supply Current
VIN Clamp Voltage
ENANBLE (EN)
EN Threshold
EN Input Leakage Current
SYMBOL
VIN
VIN-UVR
VIN-UVF
IIN-
STARTUP
IIN-SH
IIN-SW
VINC
VENR
VENF
IEN
CONDITIONS
MAX17598
MAX17599
IN rising
IN falling
VIN < UVLO
MAX17598
MAX17599
MAX17598
MAX17599
VEN = 0V
Switching, fSW = 400kHz
VEN = 0V, IIN = 2mA sinking
(MAX17598) (Note 3)
VEN rising
VEN falling
VEN = 1.5V, TA = +25NC
MIN
8
4.5
18.5
3.8
6.5
3.6
 
 
 
 
30
1.16
1.1
-100
TYP
 
 
20
4.1
7
3.9
20
20
2
33
1.21
1.15
 
MAX UNITS
29
36
21.5
4.4
7.5
4.2
32
V
V
V
FA
32 FA
mA
36 V
1.26
1.20
+100
V
nA
Maxim Integrated
  2

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