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MAX8969 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Step-Up Converter - Maxim Integrated Products

भाग संख्या MAX8969
समारोह Step-Up Converter
मैन्युफैक्चरर्स Maxim Integrated Products 
लोगो Maxim Integrated Products लोगो 
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<?=MAX8969?> डेटा पत्रक पीडीएफ

MAX8969 pdf
MAX8969
Step-Up Converter for Handheld Applications
Absolute Maximum Ratings
IN, OUT_ to GND_................................................-0.3V to +6.0V
EN, TREN to GND_............ -0.3V to lower of (VIN + 0.3V) or 6V
Total LX_ RMS Current (Note 1)....................................3.2ARMS
OUT_ Short Circuit to GND_......................................Continuous
Continuous Power Dissipation (TA = +70°C)
WLP (derate 12mW/NC above +70°C)........................960mW
Operating Temperature Range.............................-40ºC to +85°C
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Soldering Temperature (reflow) (Note 2).......................... +260°C
Note 1: LX_ has internal silicon diodes to GND_ and OUT_. It is normal for these diodes to briefly conduct during LX_ transitions.
Avoid steady state conduction of these diodes.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile that the
device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder pro-
files recommended in the industry-standard specification JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection
reflow. Preheating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics (Note 1)
WLP
Junction-to-Ambient Thermal Resistance (θJA)...........83°C/W
Junction-to-Case Thermal Resistance (θJC)................50°C/W
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VIN = 2.6V, TA = -40°C to +85°C, unless otherwise noted. Typical values are TA = +25°C.) (Note 4)
PARAMETER
CONDITIONS
MIN
Operating Input Voltage Range
Minimum Startup Voltage
2.5
Undervoltage Lockout Threshold (UVLO)
Shutdown Supply Current
Thermal Shutdown Temperature
BOOST MODE
VIN falling, 75mV hysteresis
VEN = VTREN = VOUT = 0V,
VIN = 4.8V
TJ rising, 20NC hysteresis
TA = +25NC
TA = +85NC
2.1
Peak Output Current
Minimum Continuous Output Current
Switching Frequency
VIN > 2.5V, pulse loading (Note 5)
VOUT = 3.3V
VOUT = 3.5V
VOUT = 3.7V
VIN > 2.5V (Note 5)
VOUT = 4.25V
VOUT = 5.0V
VOUT = 5.3V
VOUT = 5.5V
(Note 6)
TYP
2.3
2.2
0.8
1
+165
MAX
5.5
2.3
5
UNITS
V
V
V
FA
NC
1A
0.9
0.8
0.7
0.7 A
0.7
0.7
0.7
3 MHz
www.maximintegrated.com
Maxim Integrated 2

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डाउनलोड[ MAX8969 Datasheet.PDF ]


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