Cyclone III
Devices
Altera Device Package Information Data Sheet
Thermal resistance values for Cyclone III devices are provided for a board
meeting JEDEC specifications and for a typical board. The JEDEC board
specifications require two signals and two power/ground planes and are
available at www.jedec.org. The values are described in Tables 1
through 4.
Table 1. Thermal Resistance Values for Cyclone III Devices
Value
θJA (C/W) Still Air
θJA (C/W) 100 ft./minute
θJA (C/W) 200 ft./minute
θJA (C/W) 400 ft./minute
θJC (C/W)
θJB (C/W)
Description
Junction-to-ambient thermal resistance (θJA) with no airflow when a heat sink
is not being used.
Junction-to-ambient thermal resistance with 100 ft./minute airflow when a
heat sink is not being used.
Junction-to-ambient thermal resistance with 200 ft./minute airflow when a
heat sink is not being used.
Junction-to-ambient thermal resistance with 400 ft./minute airflow when a
heat sink is not being used.
Junction-to-case thermal resistance (θJC) for device.
Junction-to-board thermal resistance (θJB) for specific board being used.
Table 2 provides θJA (junction-to-ambient thermal resistance) values and
θJC (junction-to-case thermal resistance) values for Cyclone III devices on
a board meeting JEDEC specifications for thermal resistance calculation.
Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 1 of 2)
Device
EP3C5
EP3C10
Package
E144
F256
U256
M164
E144
F256
U256
M164
θJA (°C/W)
Still Air
20
32.4
32.5
38.2
20
32.4
32.5
38.2
θJA (°C/W)
100 ft./min.
17.5
28.9
29.1
31.5
17.5
28.9
29.1
31.5
θJA (°C/W)
200 ft./min.
15.4
27
27.2
29.6
15.4
27
27.2
29.6
θJA (°C/W)
400 ft./min.
14
25.5
25.6
27.9
14
25.5
25.6
27.9
θJC (°C/W)
8.4
11.7
12.2
11.6
8.4
11.7
12.2
11.6
2
www.DataSheet.in
DS-CYTHRML-3.0
Altera Corporation
