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OPA2333 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - CMOS OPERATIONAL AMPLIFIERS - Burr-Brown Corporation

भाग संख्या OPA2333
समारोह CMOS OPERATIONAL AMPLIFIERS
मैन्युफैक्चरर्स Burr-Brown Corporation 
लोगो Burr-Brown Corporation लोगो 
पूर्व दर्शन
1 Page
		
<?=OPA2333?> डेटा पत्रक पीडीएफ

OPA2333 pdf
OPA333
OPA2333
SBOS351 − MARCH 2006
wwwww.Dwat.taiS.choemet4U.com
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7V
Signal Input Terminals, Voltage(2) . . . . . . . . . −0.3V to (V+) + 0.3V
Signal Input Terminals, Voltage(2) . . . . . . . . . . . . . . . . . . . . ±10mA
Output Short-Circuit(3) . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Operating Temperature . . . . . . . . . . . . . . . . . . . . . −40°C to +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
ESD Rating
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4000V
Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000V
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2) Input terminals are diode-clamped to the power-supply rails.
Input signals that can swing more than 0.3V beyond the supply
rails should be current limited to 10mA or less.
(3) Short-circuit to ground, one amplifier per package.
ORDERING INFORMATION(1)
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
OPA333
SOT23-5
DBV
OAXQ
OPA333
SC70-5
DCK
BQY
OPA333
SO-8
D O333A
OPA2333
SO-8
D O2333A
OPA2333
DFN-8(2)
DRB
BQZ
(1) For the most current specification and package information see the Package Option Addendum at the end of this document, or see the TI web
site at www.ti.com.
(2) Available Q2 ’06.
PIN CONFIGURATIONS
OUT 1
V2
+IN 3
OPA333
5 V+
4 IN
SOT23−5
+IN 1
V2
IN 3
NC(1) 1
IN 2
+IN 3
V4
OPA333
5 V+
4 OUT
SC70−5
(1) NC denotes no internal connection.
(2) Connect thermal die pad to V−.
(3) Available Q2 ’06.
OPA333
SO−8
8 NC(1)
7 V+
6 OUT
5 NC(1)
OUT A 1
IN A 2
+IN A 3
V4
OPA2333
OPA2333
A
B
SO−8
OUT A 1
IN A 2
+IN A 3
V4
Exposed
Thermal
Die Pad
on
Underside(2)
8 V+
7 OUT B
6 IN B
5 +IN B
DFN−8(3)
8 V+
7 OUT B
6 IN B
5 +IN B
2

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