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73M2901CE डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - V.22bis Single Chip Modem - Teridian Semiconductor

भाग संख्या 73M2901CE
समारोह V.22bis Single Chip Modem
मैन्युफैक्चरर्स Teridian Semiconductor 
लोगो Teridian Semiconductor लोगो 
पूर्व दर्शन
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73M2901CE pdf
73M2901CE Data Sheet
DS_w2w90w1.DCatEaS_he0e3t41U.com
Table of Contents
1 Hardware Description.................................................................................................................... 4
1.1 Power Supply ....................................................................................................................... 4
1.2 Low Power Mode .................................................................................................................. 4
1.3 Analog Line / Hybrid Interface ............................................................................................... 4
1.4 Interrupt Pins ........................................................................................................................ 4
1.5 Crystal Oscillator................................................................................................................... 5
1.5.1 Specifying a Crystal..................................................................................................... 5
1.6 Reset.................................................................................................................................... 5
1.7 Asynchronous and Synchronous Serial Data Interface .......................................................... 5
2 Pinout............................................................................................................................................. 6
3 Pin Descriptions ............................................................................................................................ 7
3.1 Power Pins ........................................................................................................................... 7
3.2 Analog Interface Pins............................................................................................................ 7
3.3 Digital Interface Pins ............................................................................................................. 7
3.4 External Interrupt Pins .......................................................................................................... 8
3.5 Oscillator Pins....................................................................................................................... 8
4 Electrical Specifications................................................................................................................ 9
4.1 Absolute Maximum Ratings................................................................................................... 9
4.2 Recommended Operating Conditions.................................................................................... 9
4.3 Receiver ............................................................................................................................... 9
4.4 Transmitter ......................................................................................................................... 10
4.5 Maximum Transmit Level .................................................................................................... 10
4.6 DC Characteristics, Vcc = 3.3 V .......................................................................................... 11
4.6.1 DC Supply Current, VDD = 2.7 V (Battery EOL)......................................................... 11
4.6.2 DC Supply Current , VDD = 3.0 V .............................................................................. 11
4.6.3 DC Supply Current VDD = 3.3 V................................................................................ 12
4.6.4 DC Supply Current VDD = 3.6 V................................................................................ 12
5 Firmware Description .................................................................................................................. 13
5.1 Firmware Overview ............................................................................................................. 13
5.2 Firmware Features.............................................................................................................. 13
6 Design Considerations................................................................................................................ 14
6.1 Layout Considerations ........................................................................................................ 14
6.2 73M2901CE Design Compatibility....................................................................................... 15
6.3 Telephone Line Interface .................................................................................................... 15
6.4 Functional Considerations................................................................................................... 16
6.4.1 SMS and V.23 Half Duplex ........................................................................................ 16
6.4.2 Leased Line Mode..................................................................................................... 16
6.4.3 73M2901CE Energy Ring Detection .......................................................................... 17
6.4.4 Caller ID Mode Changes ........................................................................................... 18
6.4.5 Selectable Answer Tone Frequency Detection........................................................... 18
6.4.6 73M2901CE S99 Country Code Support ................................................................... 18
7 Reference Designs ...................................................................................................................... 21
7.1 Low Cost Design Using DSP Ring and Status Monitoring.................................................... 21
7.2 Reference Design Using Traditional Hardware Line Monitoring ........................................... 22
8 Modem Performance Characteristics ......................................................................................... 23
8.1 BER versus SNR ................................................................................................................ 23
8.2 BER versus Receive Level.................................................................................................. 23
9 Package Mechanical Drawing ..................................................................................................... 24
9.1 32-Pin QFN ........................................................................................................................ 24
9.2 32-Pin TQFP....................................................................................................................... 25
10 Ordering Information................................................................................................................... 26
11 Related Documentation............................................................................................................... 26
12 Contact Information..................................................................................................................... 26
Revision History .................................................................................................................................. 27
2 Rev. 3.4

विन्यास 27 पेज
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