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WED3C755E8M-XBX डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - RISC MICROPROCESSOR MULTI-CHIP PACKAGE - White Electronic Designs Corporation

भाग संख्या WED3C755E8M-XBX
समारोह RISC MICROPROCESSOR MULTI-CHIP PACKAGE
मैन्युफैक्चरर्स White Electronic Designs Corporation 
लोगो White Electronic Designs Corporation लोगो 
पूर्व दर्शन
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WED3C755E8M-XBX pdf
White Electronic Designs
www.DataSheet4U.com
WED3C755E8M-XBX
FIG. 2 - BLOCK DIAGRAM
Completion
System Unit
Instruction
Fetch
Branch Unit
Control Unit
Dispatch
BHT/BTIC
32K ICache
FXU1 FXU2
GPRs
Rename
Buffers
LSU
FPRs
Rename
Buffers
FPU
32K DCache
L2Tags
L2 Cache
BIU
60x BIU
L2 Cache
Bus
60x Bus
SSRAM SSRAM
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
May, 2003
Rev 2
2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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अनुशंसा डेटापत्रक

भाग संख्याविवरणविनिर्माण
WED3C755E8M-XBXRISC MICROPROCESSOR MULTI-CHIP PACKAGEWhite Electronic Designs Corporation
White Electronic Designs Corporation


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