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MAX8896 डेटा पत्रक PDF( Datasheet डाउनलोड )


डेटा पत्रक - Dual PWM Step-Down Converter - Maxim Integrated Products

भाग संख्या MAX8896
समारोह Dual PWM Step-Down Converter
मैन्युफैक्चरर्स Maxim Integrated Products 
लोगो Maxim Integrated Products लोगो 
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<?=MAX8896?> डेटा पत्रक पीडीएफ

MAX8896 pdf
www.DataSheet4U.com
Dual PWM Step-Down Converter in a 2mm x
2mm Package for WCDMA PA and RF Power
ABSOLUTE MAXIMUM RATINGS
VCC, IN1, IN2, PAEN, RFEN1, RFEN2,
REFIN, OUT2, REFBP to AGND .........................-0.3V to +6.0V
PAOUT to AGND........................................-0.3V to (VIN1 + 0.3V)
LDO to AGND .........................................-0.3V to (VOUT2 + 0.3V)
IN1, IN2 to VCC......................................................-0.3V to +0.3V
IN1 to IN2 ..............................................................-0.3V to +0.3V
PGND1, PGND2 to AGND.....................................-0.3V to +0.3V
LX1 Current .......................................................................1ARMS
LX2 Current .......................................................................1ARMS
IN1 and PAOUT Current....................................................1ARMS
PAOUT, OUT2, LDO Short Circuit to PGND1,
PGND2 ....................................................................Continuous
Continuous Power Dissipation (TA = +70°C)
16-Bump UCSP (derate 12.5mW/°C above +70°C) ............1W
Junction-to-Ambient Thermal Resistance (θJA) (Note 1)...96°C/W
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Bump Temperature (soldering, reflow) ...........................+260°C
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = VIN1 = VIN2 = VPAEN = VRFEN1 = VRFEN2 = 3.6V, VREFIN = 0.72V, TA = -40°C to +85°C, typical values are at TA = +25°C,
unless otherwise noted.) (Note 2)
PARAMETER
INPUT SUPPLY
Input Voltage
Input Undervoltage Threshold
Shutdown Supply Current
LOGIC CONTROL
PAEN, RFEN1, RFEN2 Logic
Input High Voltage
CONDITIONS
VCC, VIN1, VIN2
VCC rising, 180mV typical hysteresis
VPAEN = VRFEN1 = VRFEN2 = 0
TA = +25°C
TA = +85°C
2.7V VCC 5.5V
MIN TYP MAX UNITS
2.7 5.5
2.52 2.63 2.70
0.1 4
0.1
V
V
µA
1.3 V
PAEN, RFEN1, RFEN2 Logic
Input Low Voltage
2.7V VCC 5.5V
0.4 V
PAEN, RFEN1, RFEN2 Internal
Pulldown Resistor
PAEN, RFEN1, RFEN2 Logic
Input Current
REFBP
REFBP Output Voltage
THERMAL PROTECTION
Thermal Shutdown
OUT1
Quiescent Supply Current
On-Resistance
Load Regulation
LX1 Leakage Current
VIL = 0
0µA IREFBP 1µA
TA = +25°C
TA = +85°C
TA rising, 20°C typical hysteresis
VRFEN1 = VRFEN2 = 0V, IPA = 0A,
no switching
p-channel MOSFET switch, ILX1 = -200mA
n-channel MOSFET rectifier, ILX1 = 500mA
RL is the inductor resistance
VIN1 = 5.5V, VLX1 = 0V
TA = +25°C
TA = +85°C
400 800 1600
0.01 1
0.1
k
µA
1.237 1.250 1.263
V
+160
°C
155
0.16 0.40
0.17 0.40
RL/2
0.1
5
1
µA
V/A
µA
2 _______________________________________________________________________________________

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